Cover tape for packaging semiconductor device and package for semiconductor device
US8033397B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 3, 2006 |
| Grant date | Oct 11, 2011 |
| Priority date | — |
| Expiry date | Mar 19, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19041
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present invention provides a cover tape for packaging a semiconductor device which protects the outer shape of the semiconductor device, and is capable of improving the mounting speed of the semiconductor device by shipment in tape, and a package for the semiconductor device using the cover tape for packaging the semiconductor device. The cover tape for packaging the semiconductor device has a net-shaped structure at least in a portion, and the cover tape for packaging the semiconductor device is pasted onto an embossed tape which has a number of pockets containing semiconductor devices. The package for the semiconductor device contains an embossed tape which has a number of pockets which contain semiconductor devices, and the cover tape for packaging the semiconductor device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.