Nano-soldering to single atomic layer
US8033445B1 · kind B1 · utility
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16Claims
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Key dates
| Filing date | Nov 13, 2008 |
| Grant date | Oct 11, 2011 |
| Priority date | — |
| Expiry date | Apr 15, 2030 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB82Y40/00
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A simple technique to solder submicron sized, ohmic contacts to nanostructures has been disclosed. The technique has several advantages over standard electron beam lithography methods, which are complex, costly, and can contaminate samples. To demonstrate the soldering technique graphene, a single atomic layer of carbon, has been contacted, and low- and high-field electronic transport properties have been measured.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.