Method for repairing cracks in components and solder material for soldering components
US8034154B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Nov 27, 2006 |
| Grant date | Oct 11, 2011 |
| Priority date | — |
| Expiry date | Jul 25, 2027 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF05B2230/80
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
The invention relates to a method for repairing components that consist of a superalloy. The method comprises the following steps: a solder material is applied to the repair site; the repair site with the applied solder material is heated until the latter melts; and the melted solder material is left to solidify. A powder blend, whose average composition corresponds to the component alloy constitutes the solder material, the blend comprising at least one elementary powder of the component alloy as one powder type and/or a pre-alloy of the component alloy.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.