Photosensitive resin composition comprising a halogen-free colorant
US8034531B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 19, 2003 |
| Grant date | Oct 11, 2011 |
| Priority date | — |
| Expiry date | Feb 13, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/161
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The present invention relates to a photosensitive resin composition comprising a) as a component (A) a green colorant of the formula (I) in which the rings A, B, C and D are substituted by hydroxy or by moiety wherein R, is hydrogen or C1,-C4.-Alkyl, R2 is hydrogen or C1,-C4-Alkyl, n is 0, 1, 2 or 3 and the ring E is unsubstituted or substituted by C1,-C6alkyl, C1,-C6alkoxy, hydroxy, NHCOR3, NHSO2, R4 or SO2NHR5, wherein R3, is C1,-C4,-Alkyl or phenyl, R4, is C1,-C4-Alkyl or phenyl and R5 is C1,-C4-Alkyl or phenyl, b) as a component (B) an alkali soluble oligomer or polymer (reactive or unreactive), c) as a component (C) a polymerizable monomer, d) as a component (D) a photoinitiator, e) as a component (E) an epoxy compound, and also, if desired, f) as a component (F) further additives, used as solder resist, etching resist or plating resist in the manufacture of printed circuit boards.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.