Solid state imaging device and manufacturing method thereof
US8034652B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 24, 2006 |
| Grant date | Oct 11, 2011 |
| Priority date | — |
| Expiry date | Jul 31, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10F39/8063
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A plurality of sensor packages (4) are fixed to a circuit assembly board (47) and placed on a lower mold die (56) of a transfer molding apparatus (54). Attached inside a cavity (58a) of an upper mold die (58) is a protection sheet (65), which will make contact with the upper face of a cover glass (6) of each sensor package (4). When the upper mold die (58) meshes with the lower mold die (56), the upper face of the cover glass (6) is tightly covered with the protection sheet (65). A plunger (62) is activated to fill the cavities (56a, 58a) with sealing resin (7). The upper face of the cover glass (6) is not stained or damaged when the peripheries of the sensor packages (4) are sealed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.