Hollow element filled curable body repair compounds
US8034852B2 · kind B2 · utility
6Cited by
11References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 19, 2007 |
| Grant date | Oct 11, 2011 |
| Priority date | — |
| Expiry date | Feb 23, 2030 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08K7/28
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A curable body repair material is described. The curable body repair material includes a curable polymeric resin, and a plurality of hollow elements. The curable body repair includes less than 3% by number of hollow elements having a diameter greater than 100 micrometers. Method of making and using the same are also described.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.