Micromechanical device which has cavities having different internal atmospheric pressures
US8035209B2 · kind B2 · utility
13Cited by
0References
3Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 4, 2009 |
| Grant date | Oct 11, 2011 |
| Priority date | — |
| Expiry date | Dec 18, 2029 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24744
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
A micromechanical device having a substrate wafer has at least one first cavity and one second cavity, the cavities being hermetically separated from each other, the first cavity having a different internal atmospheric pressure than the second cavity. The cavities are capped by a thin film cap. A method is for manufacturing a micromechanical device which has a thin film cap having cavities of different internal atmospheric pressures.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.