Bonded wafer SAW filters and methods
US8035464B1 · kind B1 · utility
33Cited by
8References
20Claims
0Family size
Assignee
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Key dates
| Filing date | Mar 5, 2009 |
| Grant date | Oct 11, 2011 |
| Priority date | — |
| Expiry date | Dec 26, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH03H9/02866
- WIPO fieldBasic communication processes
- WIPO sectorElectrical engineering
Abstract
Improved coupling coefficients and desirable filter characteristics are exhibited in a SAW filter including an electrode pattern deposited on a piezoelectric substrate bonded directly to an anti-reflective layer, wherein the anti-reflective layer is bonded to a carrier through an adhesive layer such that a preselected thickness of the anti-reflective layer is sufficient for enhancing an acoustic match between the piezoelectric substrate and the adhesive layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.