Optimizing thermal performance using thermal flow analysis
US8037893B2 · kind B2 · utility
29Cited by
33References
3Claims
0Family size
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Key dates
| Filing date | May 3, 2006 |
| Grant date | Oct 18, 2011 |
| Priority date | — |
| Expiry date | Mar 31, 2030 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T137/0379
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A computer implemented method and system for optimizing thermal performance of a computer system. An identification of a set of processor cores associated with the computer system is made and a thermal index is requested for each of the set of processor cores to form a set of thermal indexes. Proximity information and conductive property information associated with the set of processors is loaded and software is mapped to execute on an optimal processor core form the set of processor cores based the set of thermal indexes, proximity information, and conductive property information.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.