Power receptacle with enlarged heat dissipation path formed on mating face and power connector assembly thereof
US8038466B1 · kind B1 · utility
11Cited by
6References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 23, 2010 |
| Grant date | Oct 18, 2011 |
| Priority date | — |
| Expiry date | Nov 23, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01R12/7082
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A power connector assembly includes mateable power receptacle and power plug. The power receptacle includes an insulative housing and a number of receptacle power contacts received in the insulative housing. The insulative housing includes a mating surface, a mounting surface, a first slot recessed from the first mating surface, and a first through hole extending through the mounting surface to be exposed to an exterior. The first through hole is in communication with the first slot in order to form a heat dissipation path for eliminating heat generated by the receptacle power contacts.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.