Patent · US Active

Method for manufacturing a printed circuit board element as well as a printed circuit board element

US8039755B2 · kind B2 · utility

2Cited by

6References

11Claims

0Family size

Assignee

AT&S Austria Technologie & Systemtechnik Aktiengesellschaft · AT

Inventors

Wolfgang Bauer · Germering, DE
Johannes Stahr · Kindberg, AT

Key dates

Filing date	May 14, 2009
Grant date	Oct 18, 2011
Priority date	—
Expiry date	Sep 26, 2029

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10T29/49156
WIPO fieldAudio-visual technology
WIPO sectorElectrical engineering

Abstract

A circuit board element and production thereof are disclosed, whereby a noble metal is applied to a structured conductor layer on a circuit board substrate, comprising said conductor layer. The conductor layer is roughened on the surface, preferably after the structuring thereof and the noble metal applied as a layer, essentially on all of the structured roughened conductor layer, whereupon the noble metal layer surface is given a corresponding roughness.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.