System and method for dissipating heat from a semiconductor module
US8039952B2 · kind B2 · utility
6Cited by
8References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 26, 2009 |
| Grant date | Oct 18, 2011 |
| Priority date | — |
| Expiry date | Dec 23, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1572
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The system includes a circuit board, a semiconductor module, a heat dissipator, and at least one thermal via. The circuit board has substantially flat opposing first and second sides. The semiconductor module includes multiple semiconductor devices. The semiconductor module is oriented substantially parallel to the circuit board near the first side, while the heat dissipator is disposed near the second side. The thermal via extends through the circuit board to thermally couple the semiconductor module to the heat dissipator, which may be a heat spreader, heat sink, cooling fan, or heat pipe.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.