Composite carbon nanotube-based structures and methods for removing heat from solid-state devices
US8039961B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 28, 2008 |
| Grant date | Oct 18, 2011 |
| Priority date | — |
| Expiry date | Jan 20, 2029 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/62
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
One embodiment involves an article of manufacture that includes: a copper substrate plug with a front surface and a back surface; a catalyst on top of a single surface of the copper substrate plug; and a thermal interface material on top of the single surface of the copper substrate plug. The thermal interface material comprises: a layer of carbon nanotubes that contacts the catalyst, and a filler material located between the carbon nanotubes. The carbon nanotubes are oriented substantially perpendicular to the single surface of the copper substrate plug. The copper substrate plug is configured to be incorporated in a peripheral structure of a heat spreader or a heat sink. In another embodiment, the thermal interface material is on top of both the top and bottom surfaces of the copper substrate plug.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.