High frequency module
US8040286B2 · kind B2 · utility
21Cited by
5References
5Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 1, 2007 |
| Grant date | Oct 18, 2011 |
| Priority date | — |
| Expiry date | Jun 13, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/16195
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
A high-frequency module has an antenna configured by integrally connecting a slot plate laid out with radiation slots to a plate having plural thin plates formed with a waveguide for supplying power to the slot plate, using a diffusion bonding. The waveguide of the antenna is connected to a dielectric waveguide of a high-frequency package via a waveguide provided on a resin substrate, thereby configuring a slot antenna at low cost, and connecting a power-supply slot of the slot antenna to a waveguide terminal of the high-frequency package with low loss.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.