System and method for excess voltage protection in a multi-die package
US8040645B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 12, 2008 |
| Grant date | Oct 18, 2011 |
| Priority date | — |
| Expiry date | Nov 16, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D89/60
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A protection system implemented on one die of a multi-die package provides a discharge path for excess voltages incurred on one or more other die of the package. Ground paths are provided for certain circuitry in the package that have high noise-sensitivity, and ground paths are provided for certain circuitry in the package that have low noise-sensitivity relative to the high noise-sensitivity circuitry. The grounds of high noise-sensitivity circuitry of multiple die are shorted together, resulting in a common high noise-sensitivity ground. The grounds of low noise-sensitivity circuitry of multiple die are shorted together, resulting in a common low noise-sensitivity ground. A pre-designated removable path is included on the package external to the die, which shorts the common high noise-sensitivity ground and the common low noise-sensitivity ground. The removable path may be removed during manufacturing, if noise present on the shorted grounds results in unacceptable performance degradation.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.