Patent · US Active

Developing diameter applications using diameter interface servlets

US8042118B2 · kind B2 · utility

21Cited by
0References
20Claims
0Family size

Assignee

Inventors

Key dates

Filing dateFeb 14, 2007
Grant dateOct 18, 2011
Priority date
Expiry dateAug 19, 2030

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH04L67/02
  • WIPO fieldDigital communication
  • WIPO sectorElectrical engineering

Abstract

Mechanisms for developing Diameter applications are provided. The mechanisms extend the application server servlet model to support Diameter applications. A “base protocol” servlet is provided that handles the basic Diameter protocol functionality. Base application servlets are provided for each Diameter interface (for example, an “Sh” base servlet for the IMS “Sh” interface). These servlets are base classes for application code. The base application servlets implement additional semantics on top of the base protocol servlet to support additional attribute-value pair semantics. With the system and method, Diameter servlets share the same ServletContext as HTTP and SIP servlets. This mechanism facilitates communication between the various application entities and facilitates generation of converged applications.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.