Cutting mold for rigid-flexible circuit board and method for forming the same
US8042445B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 2, 2008 |
| Grant date | Oct 25, 2011 |
| Priority date | — |
| Expiry date | Jul 11, 2030 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T83/8694
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A cutting mold for removing two opposite superfluous rigid circuit boards from a rigid-flexible circuit board. A first cutter is connected to a first moldboard. A first barricade is connected to the first moldboard. The maximum vertical distance from the first barricade to the first moldboard exceeds that from the first cutter to the first moldboard. A second moldboard is opposite the first moldboard. The first and second moldboards move with respect to each other. A second cutter is connected to the second moldboard and corresponds to the first cutter. A second barricade is connected to the second moldboard and detachably abuts the first barricade. The maximum vertical distance from the second barricade to the second moldboard exceeds that from the second cutter to the second moldboard. The first and second cutters cut the superfluous rigid circuit boards when the first and second moldboards move toward each other.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.