Sealable packaging structures and applications related thereto
US8043674B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 15, 2006 |
| Grant date | Oct 25, 2011 |
| Priority date | — |
| Expiry date | Mar 19, 2027 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31938
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Heat-sealable, multi-layer composite packaging structures that are suitable for packaging and having improved sealing properties and simplified construction as compared to prior art composite film constructions are disclosed. The inventive film structure includes a first substrate, such as paper, bonded such as by extrusion lamination, to a sealable, high-barrier film. This inventive “paper-adhesive-polymer” lamination may replace prior art “paper-adhesive-foil-adhesive” foil-based tandem laminations. An improved or comparable polymer film substrate may replace the “foil-adhesive” layer components of the popular incumbent prior art structure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.