Positive photosensitive composition, pattern forming method using the composition and resin for use in the composition
US8043791B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 11, 2008 |
| Grant date | Oct 25, 2011 |
| Priority date | — |
| Expiry date | Sep 11, 2028 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S430/111
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A positive photosensitive composition ensuring wide exposure latitude and reduced line edge roughness not only in normal exposure (dry exposure) but also in immersion exposure, a pattern forming method using the positive photosensitive composition, and a novel resin contained in the positive photosensitive composition are provided, which are a positive photosensitive composition comprising (A) a resin having a specific lactone structure in the side chain and being capable of increasing the solubility in an alkali developer by the action of an acid and (B) a compound capable of generating an acid upon irradiation with an actinic ray or radiation, a pattern forming method using the positive photosensitive composition, and a novel resin contained in the positive photosensitive composition.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.