Method for forming micro-electro-mechanical system (MEMS) package
US8043897B2 · kind B2 · utility
8Cited by
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18Claims
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Key dates
| Filing date | Mar 21, 2011 |
| Grant date | Oct 25, 2011 |
| Priority date | — |
| Expiry date | Mar 21, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
A method for forming a micro-electro-mechanical systems (MEMS) package includes following steps. A plurality of MEMS units are formed on a substrate, and each of the MEMS units includes at least a MEMS sensing element and a first chamber over the MEMS sensing element. The MEMS units include electric connection pads. A plurality of covering units are formed correspondingly over the MEMS units. Each of the covering units provides a second chamber over the MEMS sensing element opposite to the first chamber. The covering units are adhered to the MEMS units by an adhesive material. The MEMS units are diced into singulated units.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.