White heat-curable silicone/epoxy hybrid resin composition for optoelectronic use, making method, premolded package, and LED device
US8044128B2 · kind B2 · utility
4Cited by
1References
14Claims
0Family size
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Key dates
| Filing date | Aug 31, 2010 |
| Grant date | Oct 25, 2011 |
| Priority date | — |
| Expiry date | Aug 31, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/12044
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A white heat-curable silicone/epoxy hybrid resin composition is provided comprising (A) a heat-curable silicone resin, (B) a triazine derived epoxy resin composition, (C) a white pigment, (D) an inorganic filler, and (E) an antioxidant. Antioxidant (E) is a phosphite compound having formula: P(OR1)(OR2)2 wherein R1 and R2 are organic groups of at least 6 carbon atoms. Components (A) and (B) are present in a weight ratio of from 5:95 to 95:5. The composition effectively cures into a product maintaining heat resistance, light resistance and improved strength over a long term.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.