Patent · US Active

Method and apparatus for the correction of defective solder bump arrays

US8044320B2 · kind B2 · utility

3Cited by

9References

17Claims

0Family size

Inventors

Enrico Herz · Ortrand, DE
Michael Teich · Mannheim, DE
Axel Becker · Altrip, DE

Key dates

Filing date	Jan 23, 2008
Grant date	Oct 25, 2011
Priority date	—
Expiry date	Oct 31, 2029

Classification

Technology area (CPC H)Electricity
CPC primaryH05K2203/0338
WIPO fieldAudio-visual technology
WIPO sectorElectrical engineering

Abstract

Disclosed is a method and apparatus for the correction of defective solder bump arrays arranged in a plurality of cavities in a mold. In the method, a faulty solder bump is searched, identified and located (i.e., its position is determined) in an arrangement of solder bumps disposed in cavities of a mold and the faulty solder bump is subsequently replaced by a prefabricated solder bump. The apparatus for carrying out the method comprises a mold holder, a scanning and locating device for finding and locating faulty solder bumps and a repair device for replacing the faulty solder bump by a prefabricated solder bump.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.