Patent · US Active

Package for a light emitting element

US8044412B2 · kind B2 · utility

282Cited by

430References

55Claims

0Family size

Assignee

TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. · TW

Inventors

Thomas Murphy · Manchester, US
Andreas A. Hase · Berlin, DE
Matthias Heschel · Copenhagen, DK

Key dates

Filing date	Oct 23, 2008
Grant date	Oct 25, 2011
Priority date	—
Expiry date	Apr 8, 2029

Classification

Technology area (CPC H)Electricity
CPC primaryH10H20/856
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A high-brightness LED module includes a substrate with a recess in which a light emitting element is mounted. The recess is defined by a sidewalls and a relatively thin membrane. At least two micro-vias are provided in the membrane and include conductive material that passes through the membrane. A p-contact of the light emitting element is coupled to a first micro-via and an n-contact of the light emitting element is coupled to a second micro-via.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.