Semiconductor light emitting devices with a substrate having a plurality of bumps
US8044422B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 6, 2010 |
| Grant date | Oct 25, 2011 |
| Priority date | — |
| Expiry date | Jun 13, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/872
Abstract
A semiconductor light-emitting device includes a substrate having an upper surface and a plurality of bumps positioned on the upper surface, a first conductive type semiconductor layer positioned on the substrate, a light-emitting structure positioned on the first conductive type semiconductor layer, and a second conductive type semiconductor layer positioned on the light-emitting structure. In one embodiment of the present disclosure, each of the bumps has a top plane substantially parallel to the upper surface, the first conductive type semiconductor layer has a plurality of protrusions each facing a portion of the substrate between the bumps, and the protrusions are spaced apart from the bumps.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.