Thermal-emitting memory module, thermal-emitting module socket, and computer system
US8044506B2 · kind B2 · utility
8Cited by
1References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 29, 2008 |
| Grant date | Oct 25, 2011 |
| Priority date | — |
| Expiry date | Nov 24, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/09781
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The invention provides a thermal-emitting memory module, a thermal-emitting module socket, and a computer system comprising the thermal-emitting memory module and the thermal-emitting module socket. An embodiment of the thermal-emitting module includes: a module substrate having electrically-conductive traces; and a semiconductor device disposed on the module substrate and coupled to the electrically-conductive traces, the module substrate including a thermal-emitting portion disposed in proximity of the semiconductor device without directly contacting the semiconductor device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.