Per die temperature programming for thermally efficient integrated circuit (IC) operation
US8044697B2 · kind B2 · utility
3Cited by
8References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 29, 2006 |
| Grant date | Oct 25, 2011 |
| Priority date | — |
| Expiry date | Jun 18, 2030 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02D10/00
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
Methods and apparatus to provide per die temperature programming for thermally efficient integrated circuit (IC) operation are described. In some embodiments, the junction temperature of an IC component is determined, e.g., to reduce power consumption and/or improve performance. Other embodiments are also described.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.