Solid-state image sensing device
US8045026B2 · kind B2 · utility
2Cited by
2References
13Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Apr 2, 2008 |
| Grant date | Oct 25, 2011 |
| Priority date | — |
| Expiry date | Feb 28, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10F39/806
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
In a solid-state image sensing device, a second substrate having transparency, including a via is placed on a solid-state image sensor having a pixel region and a logic region formed in a first substrate and in which a passive component electrically connected with the solid-state image sensor through the via is mounted on the second substrate. Thus, highly efficient location of passive components is attained for miniaturization.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.