Semiconductor wafer inspection method
US8045150B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 8, 2009 |
| Grant date | Oct 25, 2011 |
| Priority date | — |
| Expiry date | Mar 22, 2030 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01N21/9503
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A semiconductor wafer inspection method includes: an imaging step in which a first image being an image of the chamfered surface seen from the main surface side and a second image being an image of the chamfered surface seen from the back surface side are taken; a calculation step in which a first width is obtained based on the first image, the first width being a width of the chamfered surface seen from the main surface side, a second width is obtained based on the second image, the second width being a width of the chamfered surface seen from the back surface side, and a ratio of the first width to the second width thus obtained is calculated; and a shape determination step in which a form of the chamfered surface is determined to be abnormal in a case where the ratio is out of a predetermined range.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.