Thin film magnetic head including thermal deformation-preventing layer
US8045293B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 7, 2007 |
| Grant date | Oct 25, 2011 |
| Priority date | — |
| Expiry date | Apr 21, 2030 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG11B5/3136
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A thin film magnetic head includes a recording and playback element, a lead conductor layer for feeding a power to the recording and playback element, an electrically conductive bump for conductively connecting the lead conductor layer to an electrode pad for external connection, and an insulating protective layer filling between the recording and playback element and the electrically conductive bump. A thermal deformation-preventing layer composed of a material having a thermal expansion coefficient smaller than that of the insulating protective layer is disposed in the insulating protective layer in such a way as to locate between a medium-facing surface and the electrically conductive bump without being exposed at the medium-facing surface. In the resulting thin film magnetic head, protrusion of the recording and playback element toward the recording medium side can be prevented without changing the configuration of the recording and playback element nor the forming material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.