Heat dissipation device having heat pipes for supporting heat sink thereon
US8047270B2 · kind B2 · utility
3Cited by
4References
20Claims
0Family size
Assignees
Inventor
Key dates
| Filing date | Dec 29, 2007 |
| Grant date | Nov 1, 2011 |
| Priority date | — |
| Expiry date | Aug 31, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A heat dissipation device includes a base, a fin group located at a top of the base, a fan mounted on a top of the fin group, a first heat pipe and a second heat pipe. The first and second heat pipes connect with the base and the fin group and each includes a condensing portion and an evaporating portion. The evaporating portions of the first and second heat pipes are received in the base. The condensing portions of the first and the second heat pipes are located at opposite sides of the fin group respectively and extend through and support the fin group along opposite directions.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.