Device for the separation of substrates from a stack

US8047761B2 · kind B2 · utility

Assignee

• ACI ecoTec GmbH · DE

Inventors

• Felix Jaeger · Stockach, DE
• Wolfgang Schmutz · Rottweil, DE
• Michael Kieninger · Weinheim, DE

Key dates

• Filing date: May 18, 2006
• Grant date: Nov 1, 2011
• Expiry date: Apr 27, 2027

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y10T156/19
• WIPO field: Handling
• WIPO sector: Mechanical engineering

Abstract

A device for separation of damp silicon wafers from a wafer stack, whereby the damp wafers may be removed individually from the stack, transferred to a subsequent conveyor device and the damp thin fragile wafers held in the stack can be rapidly separated and isolated even in large format. The device comprises separation rollers on which the wafer stack may be placed. On rotation of the separation rollers, the lowest wafer is displaced under a doctor strip through a wafer-thin gap between the roller plane and doctor strip and withdrawn from the wafer stack by elastic pressure by a pair of superimposed delivery rollers driven at the same speed.