Sensing chip
US8048385B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Dec 31, 2008 |
| Grant date | Nov 1, 2011 |
| Priority date | — |
| Expiry date | May 5, 2029 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01N21/7703
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
There is provided a sensing chip capable of measuring a refractive index by utilizing a long-range surface plasmon polariton, accurately measuring an accumulative refractive index in a wide range, and more easily enabling sealing for measurement. The present invention relates to the sensing chip which has a thin metal film or a strip-like metal grown on an underlayer, and has a dielectric that limits a refractive index and a dielectric buffer layer on an upper surface and a lower surface of the thin metal film or the strip-like metal. The dielectric buffer layer is attached onto the thin metal film or the strip-like metal. The thin metal film or the strip-like metal and the buffer layer are sandwiched between two dielectric layers. A hole is made in a surface of the upper dielectric layer to serve as a measurement groove.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.