Method for placing material onto a target board by means of a transfer board

US8048479B2 · kind B2 · utility

Assignee

• Qimonda AG · DE

Inventors

• Harry Hedler · Germering, DE
• Roland Irsigler · Munich, DE
• Volker Lehmann · Hersbruck, DE

Key dates

• Filing date: Aug 1, 2006
• Grant date: Nov 1, 2011
• Expiry date: Jul 30, 2027

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y10T29/49155
• WIPO field: Audio-visual technology
• WIPO sector: Electrical engineering

Abstract

A method for placing material onto a target board by means of a transfer board comprising a plurality of blind holes, the method comprising the steps of immersing the transfer board in a material bath, wherein a first pressure acts on the material bath and a second pressure acts in the blind holes, and wherein the first pressure and the second pressure are substantially equal; generating a pressure difference between the first pressure and the second pressure, so that the blind holes of the transfer board are filled at least partially with the liquid material; extracting the transfer board from the material bath; and positioning the transfer board opposite to the target board, the material being expelled from the blind holes, such that the material touches the target board.