Multilayer heat sealant structures, packages and methods of making the same
US8048521B2 · kind B2 · utility
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10References
10Claims
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Assignee
Inventors
Key dates
| Filing date | Oct 12, 2007 |
| Grant date | Nov 1, 2011 |
| Priority date | — |
| Expiry date | Oct 21, 2029 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31938
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
The embodiments of the present invention relate to multilayer thermoplastic structures having improved sealability and tearability. More specifically, the present invention relates to a multilayer heat sealant structure having at least three layers that may be coextrusion coated or otherwise laminated to a substrate, such as metallized polymeric material, foil, or other substrates.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.