Pressure-sensitive adhesive sheet and process for producing semiconductor device having same
US8048690B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 9, 2008 |
| Grant date | Nov 1, 2011 |
| Priority date | — |
| Expiry date | Oct 9, 2028 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/2848
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A pressure-sensitive adhesive sheet according to the present invention is a pressure-sensitive adhesive sheet in which a pressure-sensitive adhesive layer is provided on a base film, in which the base film contains conductive fibers, and in which an electrically conductive path is formed between the pressure-sensitive adhesive layer and the base film. With this structure, an electrical continuity test can be performed even in a condition where a semiconductor wafer or a semiconductor chip formed by dicing the semiconductor wafer is applied, and deformation (warping) and damage of the semiconductor wafer and generation of flaws and scratches on the backside can be prevented in the test.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.