Semiconductor device and method for manufacturing a semiconductor device having improved heat dissipation capabilities
US8048714B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 9, 2007 |
| Grant date | Nov 1, 2011 |
| Priority date | — |
| Expiry date | Aug 4, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/1815
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device mountable to a substrate includes a semiconductor die and an electrically conductive attachment region having a first attachment surface and a second attachment surface. The first attachment surface is arranged for electrical communication with the semiconductor die. A housing at least in part encloses the semiconductor die and the interlayer material. The housing has a recess disposed through the second attachment surface of the electrically conductive attachment region. A dielectric, thermally conductive interlayer material is located in the recess and secured to the housing. A metallic plate is located in the recess and secured to the interlayer material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.