Heat dissipation device
US8050038B2 · kind B2 · utility
10Cited by
12References
13Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Jul 17, 2009 |
| Grant date | Nov 1, 2011 |
| Priority date | — |
| Expiry date | May 21, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A heat dissipation device for dissipating heat from an electronic component mounted on a printed circuit board, includes a fin unit, a heat-conducting board attached to the electronic component, a heat pipe thermally connecting the fin unit and the heat-conducting board, and a clip disposed on the heat pipe. Two engaging portions protrude upwardly from a top face of the heat-conducting board towards each other. The heat pipe extends between the two engaging portions. The two engaging portions press two opposite ends of the clip downwardly, thereby securing the heat pipe to the top face of the heat-conducting board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.