Patent · US Active

Modular enclosure

US8051617B2 · kind B2 · utility

4Cited by
334References
30Claims
0Family size

Assignee

Inventors

Key dates

Filing dateSep 20, 2010
Grant dateNov 8, 2011
Priority date
Expiry dateSep 20, 2030

Classification

  • Technology area (CPC E)Fixed Constructions
  • CPC primaryE04B1/34317
  • WIPO fieldCivil engineering
  • WIPO sectorOther fields

Abstract

A modular enclosure may include a number of interlocking components, such as panels, that may be interconnected to form sidewalls, roof and/or floor. The panels may be constructed from blow-molded plastic and a first pattern may be disposed on one surface and a second pattern may be disposed on an opposing surface. One or more points of intersection may be located where the first pattern and the second pattern overlie, and a depression may be disposed at the points of intersection. The depressions are preferably sized and configured to increase the strength and/or rigidity of the panel.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.