Method and apparatus for measuring flaw height in ultrasonic tests
US8051717B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 6, 2005 |
| Grant date | Nov 8, 2011 |
| Priority date | — |
| Expiry date | Apr 19, 2028 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01N2291/267
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
The measurement of a flaw height in a thick welded portion of a stainless steel specimen, which is difficult to perform by the TOFD method, can be conducted with more ease, with higher accuracy and in a shorter time than in the case of using tip echo techniques. In addition, it is possible to reduce variations in measurement results among individual inspectors.An ultrasonic wave 21 is launched by a transmitting probe 1 into a specimen 20 in a direction oblique to a flaw 24 to generate diffracted waves at the tip 25 of the flaw 24, then a diffracted wave 22 propagating upward directly from the flaw 24 and a diffracted wave 23 propagating upwardly of the flaw 24 after once reflected off the back 27 are received by a receiving probe 2 disposed above the flaw 24, and the height of the tip of the flaw 24 from the back 27 is measured from the propagation time difference between the received diffracted waves.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.