Apparatus for spreading heat over a finned surface
US8051896B2 · kind B2 · utility
10Cited by
47References
24Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jul 31, 2007 |
| Grant date | Nov 8, 2011 |
| Priority date | — |
| Expiry date | Sep 7, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An apparatus for spreading heat over a plurality of fins is provided. The apparatus includes a heat dissipating member composed of metal and having a plurality of fins on a first side of the heat dissipating member. The apparatus also includes a plurality of strips of thermal material having a thermal conductivity in a direction parallel to the heat dissipating member higher than a thermal conductivity of the heat dissipating member, the plurality of strips disposed on a side of the heat dissipating member opposite of the first side and configured to spread heat along the heat dissipating member.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.