Heat dissipation system and electronic device utilizing the same
US8052282B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 18, 2009 |
| Grant date | Nov 8, 2011 |
| Priority date | — |
| Expiry date | Feb 16, 2030 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03B21/16
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
An electronic device includes a heat dissipation system and an operating system. The heat dissipation system includes a housing, a first heat dissipation module received in the housing, heat pipes extending from the first heat dissipation module through the housing. The operating system includes a dust-proof housing, a heat source and a heat dissipation device. The heat source is received in the dust-proof housing and generates heat. The cooling module is adhered to an outer surface of the dust-proof housing to be cooled and attaches the heat pipes to the first heat dissipation module. The outer surface of the dust-proof housing is adjacent to the housing. The heat pipes transfer heat from the operating system into the first heat dissipation module.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.