LED package
US8053799B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 27, 2007 |
| Grant date | Nov 8, 2011 |
| Priority date | — |
| Expiry date | Mar 2, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/8582
Abstract
The present invention has an object to provide a LED package having a means capable of precisely limiting a region in which a resin containing a phosphor is dotted on a member on which an LED chip is supported. To this end, an LED package according to the present invention comprises a package body having an inner space with an LED chip mounted therein, the inner space being open toward a light emission direction; a chip support member mounted to the inner space of the package body to support the LED chip; a phosphor resin member formed by dotting resin containing a phosphor onto the LED chip; and a region limitation means provided on the chip support member and defining a region in which the phosphor resin member is formed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.