Backlight unit equipped with light emitting diodes
US8053804B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 26, 2010 |
| Grant date | Nov 8, 2011 |
| Priority date | — |
| Expiry date | Jan 26, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10409
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Disclosed herein is a backlight unit equipped with LEDs. The backlight includes an insulating substrate, a plurality of LED packages, an upper heat dissipation plate, and a lower heat dissipation plate. The insulating substrate is provided with predetermined circuit patterns. The LED packages are mounted above the insulating substrate, and are electrically connected to the circuit patterns. The upper heat dissipation plate is formed on the insulating substrate, and is configured to come into contact with the circuit patterns and to dissipate heat. The lower heat dissipation plate is formed on the insulating substrate, and is configured to transmit heat transmitted through the upper heat dissipation plate. The upper heat dissipation plate and the lower heat dissipation plate are connected to each other by at least one through hole, and the through hole and the upper heat dissipation plate have a predetermined area ratio.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.