Top bond pad bias and variation control
US8054584B2 · kind B2 · utility
5Cited by
31References
31Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 26, 2008 |
| Grant date | Nov 8, 2011 |
| Priority date | — |
| Expiry date | Apr 15, 2030 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG11B5/4826
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An assembly includes a slider and a suspension assembly. The slider includes an air bearing surface and a slider mounting surface opposite the air bearing surface. There are a plurality of slider pads on the slider mounting surface. The suspension assembly includes a plurality of suspension pads on a suspension mounting surface. Each of the suspension pads is connected to one of the slider pads with a solder joint so that the slider mounting surface has at least one of a pitch, roll, or yaw angle with respect to the suspension mounting.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.