Microfins for cooling an ultramobile device
US8054629B2 · kind B2 · utility
1Cited by
3References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 30, 2008 |
| Grant date | Nov 8, 2011 |
| Priority date | — |
| Expiry date | Oct 11, 2028 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/4935
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present invention discloses a method of cooling an ultramobile device with microfins attached to an external wall of an enclosure surrounding the ultramobile device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.