Camera module package
US8054634B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Jul 3, 2008 |
| Grant date | Nov 8, 2011 |
| Priority date | — |
| Expiry date | Jul 16, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
There is provided a camera module package including: a housing having an optical system; a board bonded to a bottom end of the housing and mounting an image sensor on a top surface thereof; a contact part integrally formed in the housing to electrically connect a sensor bonding pad of the image sensor with a board bonding pad of the board each other when the housing is engaged with the board. In the camera module package, a process of bonding the housing and the board together is performed at the same time as a process of electrically connecting the image sensor and the board to each other. This simplifies an assembly process and enhances productivity. Also, the camera module package is fundamentally free from contamination of external contact terminals caused by an overflowing bonding material when the board and the housing are bonded together.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.