Bending device
US8056387B2 · kind B2 · utility
2Cited by
4References
5Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | May 1, 2007 |
| Grant date | Nov 15, 2011 |
| Priority date | — |
| Expiry date | Nov 17, 2028 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB25J15/0019
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A bending device has a bending mechanism for bending an elongate object to be processed by holding the object by both a bending die and a clamping die and revolving the clamping die which is able to revolve around the bending die. The bending device includes a fixing base on which the bending mechanism is mounted. A chuck mechanism for holding the object is provided in the bending device, and the bending device is provided with an articulated robot for moving the chuck mechanism.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.