Evaporative compact high intensity cooler
US8056615B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Jan 17, 2007 |
| Grant date | Nov 15, 2011 |
| Priority date | — |
| Expiry date | May 6, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01S5/02469
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An evaporative compact high intensity cooler (ECHIC) for transferring heat from a heat source along a heat conduction surface of the heat source with a two-phase coolant, comprises a flow passage labyrinth of flow passages with short conduction paths interrupted by coolant columns that all radiate from at least one coolant supply passage and offer the coolant expanding volume as the coolant evaporates due to absorbing heat within the flow passages from the heat conduction surface to maintain nearly isobaric conditions for the coolant to maintain relatively constant temperature throughout the ECHIC as it absorbs heat from the heat source and limit boundary layer formation within the flow passages to improve heat transfer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.