Surface formation monitoring system and method
US8056623B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 20, 2010 |
| Grant date | Nov 15, 2011 |
| Priority date | — |
| Expiry date | Sep 20, 2030 |
Classification
- Technology area (CPC E)Fixed Constructions
- CPC primaryE21B47/125
- WIPO fieldCivil engineering
- WIPO sectorOther fields
Abstract
A subsurface formation monitoring system and method is described. The system includes a conductive piping structure positionable within a borehole extending into a subsurface formation. The conductive piping structure is electrically decoupled from a production tubing by an insulating packer. The system also includes a downhole installed conductive casing sub that has one or more sensors. The conductive casing sub is electrically coupled to the conductive piping structure. The system further includes a surface installed power and communication module that has an alternate current generator. The power and communication module is electrically coupled to the conductive piping structure via a downhole intermediate module. The alternate current generator can inject a current signal that flows downhole to the conductive casing sub and then returns with sensor measurements to the surface power and communication module via a grounded return electrode that is coupled to the subsurface formation.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.