Patent · US Active

Method and device for measuring soil parameters by means of compaction machines

US8057124B2 · kind B2 · utility

4Cited by

5References

31Claims

0Family size

Assignee

Wacker Neuson Produktion GmbH & Co. · DE

Inventors

Otto W. Stenzel · Zöblitz, DE
Stefan Wagner · Xanten, DE
Dittmar Lange · Munich, DE

Key dates

Filing date	Feb 19, 2007
Grant date	Nov 15, 2011
Priority date	—
Expiry date	Aug 25, 2028

Classification

Technology area (CPC E)Fixed Constructions
CPC primaryE02D3/074
WIPO fieldCivil engineering
WIPO sectorOther fields

Abstract

A soil compaction device has a vibrated contact element that makes contact with the soil during a contact phase and that is exposed to a contact force exerted by the soil and travels over a contact distance. A dynamic stiffness of the soil is formed from the gradient of the contact force and from the contact distance. Furthermore, a contact surface parameter to take account of the actual contact surface of the contact element with the soil is determined. The dynamic deformation modulus is then the product of the contact surface parameter and the dynamic stiffness. The method allows the determination of the dynamic deformation modulus, and hence of the soil stiffness, during the compaction operation.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.